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PEELING METHOD, PROGRAM, COMPUTER STORAGE MEDIUM, PEELING DEVICE, AND PEELING SYSTEM

机译:上等方法,程序,计算机存储介质,上等设备和上等系统

摘要

PROBLEM TO BE SOLVED: To efficiently perform processing of peeling a support substrate from a processed substrate.;SOLUTION: A peeling method includes: a step A205 of disposing a first holding part at a predetermined height position after a step A203 of position adjustment of a superposed substrate on the first holding part; a step A206 of disposing a sharp member at a predetermined height position; a succeeding step A207 of making the sharp member be in contact with a side surface on one end side of the superposed substrate to detect contact of the sharp member; a succeeding step A208 of a peeling induction part forming a peeling start part from which a support substrate is peeled from a processed substrate, on the side surface on the one end side of the superposed substrate; and a succeeding step A213 of sucking the support substrate of the superposed substrate, and peeling the support substrate from the processed substrate in a direction from the one end side to the another end side from the peeling start part as a start point by using a plurality of suction movement parts for moving the support substrate in a direction of making the support substrate separate from the processed substrate.;COPYRIGHT: (C)2015,JPO&INPIT
机译:解决的问题:为了有效地执行从处理过的基板上剥离支撑基板的处理。解决方案:剥离方法包括:在将基板的位置调整的步骤A203之后,将第一保持部布置在预定的高度位置的步骤A205。在第一保持部上叠置基板;步骤A206,将锋利的构件布置在预定的高度位置;随后的步骤A207,使尖锐部件与叠置基板的一端侧上的侧表面接触以检测尖锐部件的接触;接着,在层叠基板的一端侧的侧面上形成剥离诱导部的后续步骤A208,该剥离诱导部形成剥离开始部,从该剥离开始部将被处理基板从支撑基板上剥离。接着,在步骤A213中,吸取层叠基板的支撑基板,并以从剥离开始部开始的一端侧向另一端侧的方向为起点,从加工基板剥离支撑基板。吸移部件的制造,这些吸移部件用于沿使支撑基板与已处理基板分离的方向移动支撑基板。;版权所有:(C)2015,JPO&INPIT

著录项

  • 公开/公告号JP2015162569A

    专利类型

  • 公开/公告日2015-09-07

    原文格式PDF

  • 申请/专利权人 TOKYO ELECTRON LTD;

    申请/专利号JP20140036760

  • 申请日2014-02-27

  • 分类号H01L21/304;H01L21/683;

  • 国家 JP

  • 入库时间 2022-08-21 15:33:46

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