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PEELING METHOD, PROGRAM, COMPUTER STORAGE MEDIUM, PEELING DEVICE AND PEELING SYSTEM

机译:上等方法,程序,计算机存储介质,上等设备和上等系统

摘要

PROBLEM TO BE SOLVED: To perform peeling of a processed substrate and a support substrate efficiently.;SOLUTION: By means of a plurality of suction moving parts of a second holding section, a support substrate is peeled from a processed substrate, from one end side toward the other end side of a superposed substrate (step A213). Subsequently, an inspecting section images a first substrate entirely, and inspects presence or absence of the processed substrate in a first holding section (step A215). Thereafter, while rotating the first holding section by a rotating mechanism, the inspecting section images the outer periphery of the processed substrate, and inspects the state on the outer periphery of the processed substrate (step A216).;COPYRIGHT: (C)2016,JPO&INPIT
机译:解决的问题:为了有效地剥离处理过的基板和支撑基板。解决方案:通过第二保持部的多个抽吸移动部分,从一端侧从处理过的基板剥离支撑基板。朝向叠置基板的另一端侧(步骤A213)。随后,检查部对第一基板进行整体成像,并检查第一保持部中是否存在处理过的基板(步骤A215)。此后,在通过旋转机构使第一保持部旋转的同时,检查部对处理后的基板的外周成像,并检查处理后的基板的外周状态(步骤A216)。版权所有:(C)2016,日本特许厅

著录项

  • 公开/公告号JP2015176922A

    专利类型

  • 公开/公告日2015-10-05

    原文格式PDF

  • 申请/专利权人 TOKYO ELECTRON LTD;

    申请/专利号JP20140050766

  • 发明设计人 ITO MASANORI;SAKAMOTO RYOICHI;HARADA JIRO;

    申请日2014-03-13

  • 分类号H01L21/683;H01L21/304;H01L21/02;

  • 国家 JP

  • 入库时间 2022-08-21 15:33:25

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