首页> 外国专利> POWER MODULE METAL WIRING BOARD, POWER MODULE, POWER MODULE BOARD, AND METHOD FOR MANUFACTURING POWER MODULE METAL WIRING BOARD

POWER MODULE METAL WIRING BOARD, POWER MODULE, POWER MODULE BOARD, AND METHOD FOR MANUFACTURING POWER MODULE METAL WIRING BOARD

机译:功率模块金属接线板,功率模块,功率模块板以及制造功率模块金属接线板的方法

摘要

PROBLEM TO BE SOLVED: To provide a power module board and a power module metal wiring board, including a metal board, an insulating layer and a conductive metal wiring layer mutually laminated in close contact, and having heat dissipation and heat resistance of a power module with improved reliability, and to provide a method for manufacturing the power module and the power module metal wiring board.SOLUTION: In the power module metal wiring board at least having the metal board, the insulating layer and the conductive metal wiring layer laminated in sequence, there are provided two insulating layers including a non-thermoplastic insulative resin layer and a thermoplastic insulative resin layer, and a filler, to thereby enable close contact to the metal board and the conductive metal wiring layer, with heat dissipation, heat resistance and improved reliability.
机译:解决的问题:提供一种功率模块板和功率模块金属布线板,包括金属板,绝缘层和导电金属布线层,它们彼此紧密地层压在一起,并且具有功率模块的散热性和耐热性。解决方案:在至少具有金属板,绝缘层和导电金属布线层依次层叠的功率模块金属布线板中,提供一种制造功率模块和功率模块金属布线板的方法。 ,提供了两个绝缘层,包括非热塑性绝缘树脂层和热塑性绝缘树脂层,以及填料,从而能够与金属板和导电金属布线层紧密接触,并具有散热,耐热性和改善的特性。可靠性。

著录项

  • 公开/公告号JP2015043417A

    专利类型

  • 公开/公告日2015-03-05

    原文格式PDF

  • 申请/专利权人 DAINIPPON PRINTING CO LTD;

    申请/专利号JP20140150386

  • 发明设计人 SAKAYORI KATSUYA;NAGATSUKA YASUNORI;

    申请日2014-07-24

  • 分类号H01L23/36;H01L23/12;H05K1/05;H05K3/44;

  • 国家 JP

  • 入库时间 2022-08-21 15:31:32

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