High molecular weight epoxy resin, resin film using the high molecular weight epoxy resin, resin composition, and cured product

摘要

Provided is an epoxy resin (C) obtained by causing a bifunctional epoxy resin (A) containing at least 50 wt% of the epoxy resin (a) represented by General Formula 1, and a compound (B) having two phenolic hydroxyl groups per molecule to react in a solvent, the weight-average molecular weight in terms of a reference polystyrene by gel permeation chromatography (hereinafter, "GPC") being 30,000 to 80,000, wherein the epoxy resin can satisfy low linear expansion properties, self-film-formation properties, and handling properties (where n represents a repeating unit and is an integer 0 or greater).