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suspension substrate, method of manufacturing a substrate for suspension, suspension, suspension and hard disk drive with element

机译:悬置基板,用于悬置的基板的制造方法,悬置,悬置以及具有元件的硬盘驱动器

摘要

PROBLEM TO BE SOLVED: To provide a substrate for a suspension which has high degree of installation freedom of a via.;SOLUTION: In the substrate for the suspension, according to the present invention, which includes a metal support substrate, a base insulating layer formed on the metal support substrate, and conductor layers formed on the base insulating layer, the base insulating layer has through holes for vias having a taper angle within a range of 45° to 85°, the conductor layers have wiring layers for vias which are formed so as to surround the periphery of the through holes for the vias in a plan view and have outer diameters within a range of 40 μm to 122 μm, and connection wiring layers connected to the wiring layers for the vias, and have vias which fill the inside of the through holes for the vias and are formed of a conductive material for connecting the metal support substrate and the wiring layers for the vias.;COPYRIGHT: (C)2012,JPO&INPIT
机译:解决的问题:提供一种具有高度的通孔安装自由度的悬架基板;解决方案:根据本发明,在悬架基板中,其包括金属支撑基板,基础绝缘层基底绝缘层形成在金属支撑基板上,导体层形成在基底绝缘层上,基底绝缘层具有用于通孔的通孔,通孔的锥角在45°范围内。在导体层中,导体层具有通孔的布线层,该布线层形成为在俯视时包围通孔的通孔的周围,并且外径在40μm〜122μm的范围内。以及连接布线层,其连接至用于通孔的布线层,并具有通孔,该通孔填充用于通孔的通孔的内部并且由用于连接金属支撑基板和用于通孔的布线层的导电材料形成。 :(C)2012,JPO&INPIT

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