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Printing stencils for the manufacturing methods and technical printing of the print stencil for technical printing

机译:用于技术印刷的印刷模板的制造方法和技术印刷的印刷模板

摘要

The present invention relates to a method for producing and printing stencil printing stencils for printing technical attach the print pattern onto the substrate . The method includes providing a carrier layer of the printing stencils ( 21 ) , and providing a patterned layer of the printing stencil ( 22 ) under the support layer ( 21 ) , corresponds to at least a portion of the printed pattern for the steps of processing hollowed print image opening (22a) in the pattern layer ( 22 ) , in the region of the printed image opening (22a), is processed hollow carrier layer opening in the carrier layer ( 21 ) and (21a) I and a step . The method , the laser device is used to cut out the processing of the carrier layer opening (21a), the laser device , outputs a laser beam with a laser light pulse , hollowed machining of the support layer opening (21a) , the printing extending in the longitudinal direction of the image opening , includes a hollow process column of the carrier layer opening (21a), when the hollowed processing of each carrier layer opening of the column (21a), the focusing apparatus of the laser is positioned in each of the carrier layer opening (21a), each of the carrier layer opening (21a) , using one or more laser pulses , the hollowed out at the position (P1), hollowed in this support layer opening after processing , the focus support device for a laser device , between the two of subsequent laser pulses , that are relative to the carrier layer , the carrier layer opening hollowed out (21a), then hollowed position of the layer opening to (P2) is moved . [ Selection Figure ] Figure 4A
机译:本发明涉及一种用于生产和印刷模版的模版的方法,该模版用于将技术上的印刷图案附着在基板上。该方法包括提供印刷模板(21)的载体层,以及在支撑层(21)下方提供印刷模板(22)的图案化层,其对应于用于处理步骤的印刷图案的至少一部分。在印刷图像开口(22a)的区域中,图案层(22)中的中空的印刷图像开口(22a)被加工成在载体层(21)和(21a)中开口的中空的载体层,并进行步骤。该方法,激光装置用于切割载体层开口(21a)的加工,该激光装置输出带有激光脉冲的激光束,对支撑层开口(21a)进行中空加工,印刷延伸在图像开口的纵向方向上,包括载体层开口(21a)的中空处理柱,当对柱(21a)的每个载体层开口进行中空处理时,将激光的聚焦装置定位在每个载体层开口(21a),每个载体层开口(21a),利用一个或多个激光脉冲,在位置(P1)上挖空,加工后在该支承层开口中挖空,用于在相对于载体层的随后的两个激光脉冲之间的激光装置中,将载体层的开口挖空(21a),然后将开口到(P2)的层的挖空位置移动。 [选择图]图4A

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