首页>
外国专利>
Electronic component implementing structure intermediate body, electronic component implementing structure body and manufacturing method of electronic component implementing structure body
Electronic component implementing structure intermediate body, electronic component implementing structure body and manufacturing method of electronic component implementing structure body
展开▼
机译:电子零件安装构造体,电子零件安装构造体以及电子零件安装构造体的制造方法
展开▼
页面导航
摘要
著录项
相似文献
摘要
An implementing structure intermediate body including: a first chip having a first connection terminal; a second chip having a second connection terminal in a face that faces the first chip; and a film wiring substrate having a third connection terminal in one face, which is arranged between the first chip and the second chip, is loaded on a chip loading substrate having a fifth connection terminal so that another one face of the first chip is confronted thereby. In the film wiring substrate, there is a portion that is located outside any of the first chip and the second chip, at the tip part, is provided a fourth connection terminal connected to the third connection terminal by wiring, one part of the first connection terminal is connected with the second connection terminal, the third connection terminal is connected with another one part of the first connection terminal, and the fifth connection terminal is connected to the fourth connection terminal.
展开▼