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Method for compensating for wafer shape measurement variation due to variation of environment temperature
Method for compensating for wafer shape measurement variation due to variation of environment temperature
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机译:补偿由于环境温度变化引起的晶片形状测量变化的方法
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摘要
Disclosed herein is a method and apparatus for reducing measurement error resulting from temperature variations across a wafer, without measuring the wafer temperature, the temperature gradient in the surrounding air, or the distribution of the index of refraction of the air.
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