'A DEVICE FOR DRYING/CURING OF SCREEN PRINTED PATTERNS ON SILICON WAFERS IN A CONVENTIONAL DRYING BELT FURNACE PREVENTING THE SILICON WAFERS FROM DIRECT CONTACT WITH THE BELT TO ELIMINATE CONTAMINATION OF THE WAFERS'

摘要

A device for drying/curing of screen printed patterns on silicon wafers in a conventional drying belt furnace preventing the silicon wafers from direct contact with the belt to eliminate contamination of the wafers comprising producing at least three different types of segments by cutting a stainless steel wire about 2 mm diameter; the first type of segment (A) formed in "U" shape with extended arms on both sides, the second type of segment (C) formed in "L" shape, and the third type of segment (B) formed as a horizontal member; welding of the three types of segments (A, B, C) at nine points (WJ), wherein the number of the segments formed are two in case of the first segment (A), in case of third type segment (B), and three for the second type (C), wherein the length of the - each segments A, B and C is selected in a ratio of 2.75 :1 : 1.90, wherein the height of the first and the second segment (A, C) is in the ratio of 1: 1.20, and wherein the extended arm length of the first segment (A) on both sides of the "U" is 21% of the length of first segment (A).