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Integrated temperature regulator and methods of selectively generating heat and regulating temperature

机译:集成温度调节器以及选择性产生热量和调节温度的方法

摘要

Integrated temperature regulator and methods of selectively generating heat and regulating temperature In the present technique, an integrated temperature regulator for regulating a temperature of an object is presented. The integrated temperature regulator includes a heating module and an object port. The heating module includes a semiconductor material substrate. The semiconductor material substrate includes at least one logic block at a given location. The logic block is operable to selectively generate a specific amount of heat for heating the object. The specific amount of heat generated is in response to at least one predetermined computational instruction provided as an input to the logic block. The object port is for receiving the object wherein the object port is in thermal contact with the logic block. The present technique also presents a method for selectively generating a specific amount of heat for heating an object and a temperature regulating method for regulating a temperature of an object.
机译:集成温度调节器和选择性地产生热量并调节温度的方法在本技术中,提出了一种用于调节物体温度的集成温度调节器。集成温度调节器包括加热模块和对象端口。加热模块包括半导体材料衬底。半导体材料衬底在给定位置包括至少一个逻辑块。逻辑块可操作以选择性地产生特定量的热量以加热物体。产生的特定热量响应于至少一个预定的计算指令而提供,作为逻辑块的输入。物体端口用于容纳物体,其中物体端口与逻辑块热接触。本技术还提出了一种用于选择性地产生特定量的热量以加热物体的方法以及一种用于调节物体的温度的温度调节方法。

著录项

  • 公开/公告号IN2013KO01290A

    专利类型

  • 公开/公告日2015-05-15

    原文格式PDF

  • 申请/专利权人 SIEMENS AG;

    申请/专利号IN2013KOL1290

  • 发明设计人 VARUN AV;

    申请日2013-11-13

  • 分类号G06F1/08;H04M3/42;

  • 国家 IN

  • 入库时间 2022-08-21 15:14:54

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