SUB-CASE OF ELECTRONIC DEVICE FOR COMMUNICATIONS, MANUFACTURING METHOD THEREOF AND MOLD THEREFOR, AND MANUFACTURING METHOD OF ANTENNA PATCH THEREFOR AND ANTENNA PATCH MANUFACTURED THEREBY

摘要

The present invention relates to a sub-case of an electronic device for communications, a manufacturing method thereof and a mold therefor, and a manufacturing method of an antenna patch therefor and an antenna patch manufactured thereby. According to the present invention, the sub-case of the electronic device for communications, comprises: a case main body connected to a main case of an electronic device for communications, and made of non-metallic material in a plate or block shape; and an antenna patch (1) attached onto a surface of the case main body, integrally equipped in the case main body, and formed only with an antenna pattern made of a metallic material capable of receiving radio waves. The antenna patch (1) is formed only with the antenna pattern which is capable of receiving the radio waves and made of the metallic material thin film having excellent strength more than that of copper. Accordingly, the present invention is almost not disconnected or damaged since the strength of the antenna pattern is greater than that of the copper, and can be easily attached onto a case surface of a terminal in various shapes such as a curved shape and the like since a pattern can be thinned.;COPYRIGHT KIPO 2016