首页> 外国专利> LIGHT REFLECTING MATERIAL, PACKAGE FOR LIGHT EMITTING ELEMENT ACCOMMODATION, LIGHT EMITTING DEVICE AND PROCESS FOR PRODUCING PACKAGE FOR LIGHT EMITTING ELEMENT ACCOMMODATION

LIGHT REFLECTING MATERIAL, PACKAGE FOR LIGHT EMITTING ELEMENT ACCOMMODATION, LIGHT EMITTING DEVICE AND PROCESS FOR PRODUCING PACKAGE FOR LIGHT EMITTING ELEMENT ACCOMMODATION

机译:反射材料,用于发光元件容纳的包装,发光装置以及用于制造用于发光元件容纳的包装的过程

摘要

[PROBLEMS] To provide a package for light emitting element accommodation that realizes enhanced reflectance without application of a metal plating onto a ceramic. [MEANS FOR SOLVING PROBLEMS] There is provided a package for light emitting element accommodation comprising ceramic substrate (2) having conductor mounting region (8) for mounting of light emitting element (1) on its upper surface; frame (4) of a light reflecting material containing 74.6 mass% or more of alumina whose average particle diameter after sintering is 2.5 µm or less, the frame (4) disposed on an upper surface of the substrate (2) in such a fashion that internal circumferential surface (7) of through-hole (3) expands outward; and light emitting element (1) mounted on the conductor mounting region (8) of the substrate (2). Thus, the reflectance of the frame (4) is enhanced without application of a metal plating thereonto.
机译:[问题]提供一种用于发光元件容纳的包装,该包装实现增强的反射率而无需在陶瓷上施加金属镀层。 [解决问题的手段]提供了一种用于发光元件容纳的包装,该包装包括陶瓷基板(2),该陶瓷基板具有在其上表面上安装发光元件(1)的导体安装区域(8);包含74.6质量%以上的氧化铝的光反射材料的框架(4),其烧结后的平均粒径为2.5μm或更小,框架(4)以如下方式设置在基板(2)的上表面上:通孔(3)的内周面(7)向外膨胀。发光元件(1)安装在基板(2)的导体安装区域(8)上。因此,无需在框架(4)上施加金属镀层即可提高框架(4)的反射率。

著录项

  • 公开/公告号EP1953836B1

    专利类型

  • 公开/公告日2016-01-13

    原文格式PDF

  • 申请/专利权人 NIPPON CARBIDE KOGYO KK;

    申请/专利号EP20060833079

  • 申请日2006-11-21

  • 分类号H01L33/60;C04B35/10;G02B5/08;C04B35/111;H01L33/48;

  • 国家 EP

  • 入库时间 2022-08-21 14:52:34

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