METHOD FOR STUDYING THE TEMPERATURE RELIABILITY OF EN ELECTRONIC COMPONENT

摘要

The invention relates to a method for analysing the temperature reliability of an electronic component (10) comprising an electronic chip (12) mounted in a housing (11), said electronic chip (12) consisting of a plurality of layers (13-15) of materials. The invention is characterised in that the method comprises the following steps: thermally coupling a thermally conductive coupling body (25) to the electronic chip (12); determining a wavelength according to the layers (13-15) of material to be crossed and the absorption rate of a layer of material to be used; and thermally stressing an area of interest (20) by means of a laser source (32) emitting the pre-determined wavelength.