Reduction type electroless silver plating solution and reduction type electroless silver plating method

摘要

PROBLEM TO BE SOLVED: To provide: a reducing electroless silver plating solution that can form a plated film having favorable film characteristics and a favorable appearance by preventing decomposition of the silver to maintain the stability of the silver in the plating solution and by preventing an underlying metal or the like from becoming excessively roughened; and a reducing electroless silver plating method using the silver plating solution.;SOLUTION: The reducing electroless silver plating solution contains an aqueous silver salt and a reducing agent, and contains cyanide ions at 0.006×10^-3 to 12.5×10^-3 mol/L.;COPYRIGHT: (C)2013,JPO&INPIT