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Method of fabricating CMOS inverter and integrated circuits utilizing strained silicon surface channel MOSFETS

机译:利用应变硅表面沟道MOSFET制造CMOS反相器和集成电路的方法

摘要

A method of fabricating a circuit comprising an nMOSFET includes providing a substrate, depositing a strain-inducing material comprising germanium over the substrate, and integrating a pMOSFET on the substrate, the pMOSFET comprising a strained channel having a surface roughness of less than 1 nm. The strain-inducing material is proximate to and in contact with the pMOSFET channel, the strain in the pMOSFET channel is induced by the strain-inducing material, and a source and a drain of the pMOSFET are at least partially formed in the strain-inducing material.
机译:一种制造包括nMOSFET的电路的方法,该方法包括:提供衬底;在衬底上沉积包括锗的应变诱导材料;以及在衬底上集成pMOSFET,该pMOSFET包括表面粗糙度小于1 nm的应变沟道。所述应变诱导材料邻近所述pMOSFET沟道并与所述pMOSFET沟道接触,所述pMOSFET沟道中的应变由所述应变诱导材料诱发,并且所述pMOSFET的源极和漏极至少部分地形成在所述应变诱发中。材料。

著录项

  • 公开/公告号US9219065B2

    专利类型

  • 公开/公告日2015-12-22

    原文格式PDF

  • 申请/专利权人 EUGENE A. FITZGERALD;NICOLE GERRISH;

    申请/专利号US20090573589

  • 发明设计人 NICOLE GERRISH;EUGENE A. FITZGERALD;

    申请日2009-10-05

  • 分类号H01L29/72;H01L27/092;H01L21/8238;H01L29/10;

  • 国家 US

  • 入库时间 2022-08-21 14:29:23

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