首页> 外国专利> WASHING SOLUTION FOR SURFACE OF ELECTROLESS TIN PLATING FILM, REPLENISHING SOLUTION FOR SAID WASHING SOLUTION, AND METHOD FOR FORMING TIN PLATING LAYER

WASHING SOLUTION FOR SURFACE OF ELECTROLESS TIN PLATING FILM, REPLENISHING SOLUTION FOR SAID WASHING SOLUTION, AND METHOD FOR FORMING TIN PLATING LAYER

机译:化学镀锡膜表面的洗涤溶液,所述洗涤溶液的补足溶液和形成镀锡层的方法

摘要

The present invention relates to: a washing solution for a tin plating film, which can be used for washing in advance of the washing with water after electroless tin plating; and a method for forming a tin plating layer, which includes a step of washing with the washing solution. The washing solution according to the present invention is an acidic aqueous solution containing an acid, a complexing agent, a stabilizer and a chloride ion. The washing solution contains the chloride ion at a concentration of 2% by weight or more, and also contains tin at a concentration of 0.5% by weight or less. The washing solution according to the present invention has good washing performance against the surface of a tin plating film, can maintain the properties of the tin plating film readily, has a small influence on the surface of the plating film even when used continuously, and has excellent long-term stability.
机译:本发明涉及一种用于镀锡膜的清洗液,其可用于在化学镀锡后的水洗之前进行清洗。形成镀锡层的方法,其包括用清洗液清洗的步骤。根据本发明的洗涤溶液是包含酸,络合剂,稳定剂和氯离子的酸性水溶液。洗涤溶液包含浓度为2重量%以上的氯离子,并且还包含浓度为0.5重量%以下的锡。根据本发明的清洗液对锡镀膜的表面具有良好的清洗性能,可以容易地保持锡镀膜的性能,即使连续使用,对镀膜的表面的影响也较小,并且具有优异的长期稳定性。

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