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MANUFACTURING METHOD FOR DUAL-GATE OXIDE SEMICONDUCTOR TFT SUBSTRATE, AND STRUCTURE OF DUAL-GATE OXIDE SEMICONDUCTOR TFT SUBSTRATE

机译:双栅极氧化物TFT基板的制造方法及双栅极氧化物TFT基板的结构

摘要

A manufacturing method for a dual-gate oxide semiconductor TFT substrate, and a structure of the dual-gate oxide semiconductor TFT substrate. The manufacturing method for the dual-gate oxide semiconductor TFT substrate uses a halftone mask plate to perform a photomask process to both complete patterning of an oxide semiconductor layer and obtain an oxide conductor layer (53') via ion doping. Patterning processing is performed simultaneously on a bottom gate insulating layer (31) and a top gate insulating layer (32) via a photomask process. Patterning processing is performed simultaneously on a second metal layer and a third metal layer via a photomask process, and a first source (81), a first drain (82), a second source (83), a second drain (84), a first top gate (71) and a second top gate (72) are obtained. Patterning processing is performed simultaneously on a second flat layer (9), a passivation layer (8) and the top gate insulating layer (32) via a photomask process. The number of photomask processes is reduced to nine, the processes are effectively simplified, production efficiency is increased, and production costs are decreased.
机译:用于双栅氧化物半导体TFT基板的制造方法以及双栅氧化物半导体TFT基板的结构。用于双栅氧化物半导体TFT基板的制造方法使用半色调掩模板执行光掩模工艺,以完成对氧化物半导体层的构图并经由离子掺杂获得氧化物导体层(53')。经由光掩模工艺同时在底栅绝缘层(31)和顶栅绝缘层(32)上进行图案化处理。经由光掩模工艺在第二金属层和第三金属层上同时进行图案化处理,并且第一源极(81),第一漏极(82),第二源极(83),第二漏极(84),获得第一顶栅(71)和第二顶栅(72)。经由光掩模工艺在第二平坦层(9),钝化层(8)和顶栅绝缘层(32)上同时执行图案化处理。光掩模工艺的数量减少到了9个,有效地简化了工艺,提高了生产效率,并降低了生产成本。

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