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METHOD AND APPARATUS FOR TEACHING DELIVERY LOCATION AND APPARATUS FOR PROCESSING SUBSTRATE
METHOD AND APPARATUS FOR TEACHING DELIVERY LOCATION AND APPARATUS FOR PROCESSING SUBSTRATE
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机译:授课地点的教学方法和装置以及处理基质的装置
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摘要
(challenge) provides also possible to accurately teaches a position also the substrate for the hand of a conventional substrate processing apparatus position teaching method, also position teaching device and a substrate processing apparatus. And (solving means) may position teaching apparatus, it has the same shape as the substrate such as a semiconductor wafer to be processed by the apparatus, provided with the teachings substrate 100 for the conductive coating made on its surface. The teaching device is also located, the base line (21) is formed on an upper surface thereof, has a base member 20 consisting of an insulating coating on its surface. The base member 20 is formed on, respectively, the entrance to the contact member having the shape of a pillar shape extending in the vertical direction (31), the inlet contact member 32, contact members for the Y-direction (41), the contact for the Y-direction member 42, an upright X-direction the contact members (51) are provided. ;
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