首页>
外国专利>
ULTRASONIC BONDING TOOL, METHOD FOR MANUFACTURING ULTRASONIC BONDING TOOL, ULTRASONIC BONDING METHOD, AND ULTRASONIC BONDING APPARATUS
ULTRASONIC BONDING TOOL, METHOD FOR MANUFACTURING ULTRASONIC BONDING TOOL, ULTRASONIC BONDING METHOD, AND ULTRASONIC BONDING APPARATUS
展开▼
机译:超声键合工具,制造超声键合工具的方法,超声键合方法和超声键合装置
展开▼
页面导航
摘要
著录项
相似文献
摘要
An object of the present invention is to provide an ultrasonic bonding tool capable of bonding a lead wire, without any trouble, even to a surface of a thin-film base having a plate thickness of 2 mm or less such as a glass substrate. In the present invention, a surface portion of a chip portion (1c) of an ultrasonic bonding tool (1) used in an ultrasonic bonding apparatus has a plurality of planar portions (10) formed so as to be separated from one another, and a plurality of concavities (11) formed between the plurality of planar portions. Each of the plurality of planar portions (10) has a flatness of 2 µm or less.
展开▼