TIME-VARIANT TEMPERATURE-BASED 2-D AND 3-D WIRE ROUTING

摘要

Various features pertain to circuit design schemes that route wires based on temperature. In one aspect, time-variant temperature conditions along a prospective route are taken into account when determining whether to use the route for a wire. For example, a route can be selected from among a set of prospective two-dimensional (2-D) or three-dimensional (3-D) routes based on which route is associated with the smoothest temperature gradient. Other aspects of the disclosure pertain to determining or exploiting adjustable search windows, layer wiring densities, worst-case skew values and resistance-capacitance (RC) coupling characteristics, particularly for use with 3-D routing within the layers of a stacked multi-layer substrate.