首页> 外国专利> VAPOR GROWTH RATE MEASURING DEVICE, VAPOR GROWTH DEVICE, AND VAPOR GROWTH RATE DETECTING METHOD

VAPOR GROWTH RATE MEASURING DEVICE, VAPOR GROWTH DEVICE, AND VAPOR GROWTH RATE DETECTING METHOD

机译:蒸气成长率测定装置,蒸气成长装置及蒸气成长率检测方法

摘要

PROBLEM TO BE SOLVED: To provide a vapor growth device and a growth rate detecting method, capable of simply and accurately detecting a growth rate of a thin film on a substrate.;SOLUTION: A vapor growth device 1 comprises: a chamber 2 which forms a film on a wafer W; a gas supply unit 3 which supplies a raw material gas to the wafer W in the chamber 2; a raw material discharge unit 4 located in the upper part of the chamber 2; a susceptor 5 which supports the wafer in the chamber 2; a rotation unit 6 which holds the susceptor to rotate; a heater 7 which heats the wafer; a gas discharge unit 8 which discharges a gas in the chamber; an exhaust mechanism 9 which exhausts a gas from the gas discharge unit; a radiation thermometer 10 which measures a temperature of the wafer; and a control unit 11 which controls each unit. The radiation thermometer provided on the upper surface of the raw material discharge unit irradiates the wafer with light from a light source, receives the reflection light, measures a reflection light intensity of the wafer, measures a thermal radiation light intensity from a film growth surface Wa of the wafer, and calculates a temperature of the wafer from the thermal radiation light intensity and a reflectivity.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2017,JPO&INPIT
机译:解决的问题:提供一种能够简单且准确地检测基板上的薄膜的生长速率的气相生长装置和生长速率检测方法。解决方案:气相生长装置1包括:腔室2,其形成晶片W上的膜;气体供给部3向腔室2内的晶片W供给原料气体。原料排出单元4位于腔室2的上部。基座5将晶片支撑在腔室2中。旋转单元6,其使基座旋转。加热器7,其加热晶片;气体排出单元8,其在腔室内排出气体。排气机构9,其从气体排出单元排出气体。辐射温度计10,用于测量晶片的温度。控制单元11控制每个单元。设置在原料排出单元的上表面上的辐射温度计用来自光源的光照射晶片,接收反射光,测量晶片的反射光强度,测量来自膜生长表面Wa的热辐射光强度。 ;并根据热辐射光强度和反射率计算出晶片的温度。;选定的图纸:图1;版权:(C)2017,JPO&INPIT

著录项

  • 公开/公告号JP2017143241A

    专利类型

  • 公开/公告日2017-08-17

    原文格式PDF

  • 申请/专利权人 NUFLARE TECHNOLOGY INC;

    申请/专利号JP20160187520

  • 发明设计人 IECHIKA YASUSHI;

    申请日2016-09-26

  • 分类号H01L21/205;H01L21/66;C23C16/52;

  • 国家 JP

  • 入库时间 2022-08-21 14:00:41

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