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SURFACE WETTABILITY CONTROL MEDIUM, SURFACE WETTABILITY CONTROL METHOD, PRINTED WIRING BOARD, AND ELECTRONIC APPARATUS

机译:表面润湿性控制介质,表面润湿性控制方法,印刷线路板和电子设备

摘要

PROBLEM TO BE SOLVED: To provide a method for forming, easily and with high dimensional accuracy, a via post that penetrates an insulation film for electrically connecting conductors of wiring patterns or the like via the insulation film with each other.;SOLUTION: A surface wettability control medium for controlling a water contact angle of a contacted part of a contacted body 22 in surface-contact with a smooth or patterned resin surface 10 within a range from 40° to 90° is brought into contact with the resin surface 10.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2018,JPO&INPIT
机译:解决的问题:为了提供一种容易且以高尺寸精度形成通孔柱的方法,该通孔柱穿透绝缘膜以使布线图案等的导体经由绝缘膜彼此电连接;解决方案:表面使润湿性控制介质与树脂表面10接触,该润湿性控制介质用于在40°至90°的范围内将与光滑或图案化的树脂表面10表面接触的接触体22的接触部分的水接触角控制为;选图:图1;版权:(C)2018,JPO&INPIT

著录项

  • 公开/公告号JP2017183561A

    专利类型

  • 公开/公告日2017-10-05

    原文格式PDF

  • 申请/专利权人 IDEMITSU KOSAN CO LTD;

    申请/专利号JP20160070035

  • 发明设计人 SUNAGAWA MISA;

    申请日2016-03-31

  • 分类号H05K3/12;H05K3/10;

  • 国家 JP

  • 入库时间 2022-08-21 13:58:55

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