SUBSTRATE FOR HIGH FREQUENCY PRINTED WIRING BOARD, HIGH FREQUENCY PRINTED WIRING BOARD, METHOD FOR MANUFACTURING SUBSTRATE FOR HIGH FREQUENCY PRINTED WIRING BOARD, AND METHOD FOR MANUFACTURING HIGH FREQUENCY PRINTED WIRING BOARD

摘要

PROBLEM TO BE SOLVED: To provide a substrate for a high frequency printed wiring board which can reduce a transmission loss and suppresses a loss caused by a skin effect, and can improve high frequency characteristics.SOLUTION: A substrate for a high frequency printed wiring board has a dielectric layer that contains a fluorine resin as a main component and of which a surface side is surface-modified, and a seed layer layered on one surface of the dielectric layer, where the seed layer contains metal as a main component and has an average thickness of 2 μm or less, the metal may be copper or a copper alloy, the seed layer may be formed of a sintered body of metal particles, the metal particles preferably have an average particle size of 1 nm or more and 500 nm or less, the seed layer preferably has an average thickness of 10 nm or more and 1 μm or less, the arithmetic average thickness Ra of the other surface of the seed layer is preferably 2 μm or less, and a plating layer may be provided on one surface side of the seed layer.SELECTED DRAWING: Figure 1