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Contamination evaluation method for semiconductor epitaxial wafer and contamination evaluation method for epitaxial growth apparatus using the same
Contamination evaluation method for semiconductor epitaxial wafer and contamination evaluation method for epitaxial growth apparatus using the same
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机译:半导体外延晶片的污染评价方法及使用该污染评价方法的外延生长装置的污染评价方法
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摘要
To provide a contamination evaluation method capable of evaluating contamination of the outermost surface portion of a semiconductor epitaxial wafer by using the DLTS method.A method for evaluating contamination of a semiconductor epitaxial wafer according to the present invention comprises a first step of forming an epitaxial layer on a surface of a semiconductor wafer, a second step of forming an epitaxial layer for measurement, forming a Schottky junction And a fourth step S40 of obtaining a DLTS spectrum in the adjacent region by the DLTS method, wherein the epitaxial layer and the measurement epitaxial layer are of the same conductivity type, and in the second step, , The thickness of the measurement epitaxial layer is formed larger than the thickness of the depletion layer formed by the Schottky junction.BACKGROUND OF THE INVENTION
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