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Enhancement mode GaN HEMT device with gate spacer and method of manufacturing the same

机译:具有栅极间隔物的增强模式GaN HEMT器件及其制造方法

摘要

An enhancement-mode gallium nitride (GaN) transistor (200) comprises a substrate (11); buffer material (12) over the substrate; barrier material (14) over the buffer material; a gate III-V compound (15) over the barrier material; a gate metal (17) over the gate III-V compound; and spacer material (21) formed at least on sidewalls of the gate metal. An independent claim is included for forming the enhancement mode GaN transistor, involving forming buffer material on a substrate; forming AlGaN barrier over the buffer material; forming III-V compound over the AlGaN barrier; forming stacks comprising a gate metal over the gate III-V compound; forming spacer material on at least sidewalls of the gate metal stacks; etching the III-V compound using the gate metal and spacer material as a mask; depositing a dielectric layer; etching the dielectric layer to open drain and source contact areas; and forming Ohmic drain and source contacts in the open drain and source contact areas.
机译:增强模式氮化镓(GaN)晶体管(200)包括基板(11);衬底上的缓冲材料(12);在缓冲材料上的阻挡材料(14);势垒材料上方的栅极III-V化合物(15);栅极III-V化合物上方的栅极金属(17);间隔材料(21)至少形成在栅极金属的侧壁上。包括形成增强模式GaN晶体管的独立权利要求,涉及在衬底上形成缓冲材料;在缓冲材料上形成AlGaN势垒;在AlGaN势垒上形成III-V族化合物;在栅极III-V化合物上方形成包括栅极金属的堆叠;在栅极金属堆叠的至少侧壁上形成间隔物材料;使用栅极金属和间隔物材料作为掩模蚀刻III-V族化合物;沉积介电层;蚀刻介电层以打开漏极和源极接触区域;在漏极和源极的开路接触区域中形成欧姆漏极和源极接触。

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