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Lead-free solder, lead-free solder ball, solder joint using this lead-free solder, and semiconductor circuit having this solder joint
Lead-free solder, lead-free solder ball, solder joint using this lead-free solder, and semiconductor circuit having this solder joint
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机译:无铅焊料,无铅焊球,使用该无铅焊料的焊点以及具有该焊点的半导体电路
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摘要
Ag: 1.2 to 4.5% by mass, Cu: 0.25 to 0.75% by mass, Bi: 1 to 5.8% by mass, Ni: 0.01 to 0.15% by mass, balance Sn It is a lead-free solder characterized by this. By using this addition amount, general solder characteristics such as wettability and shear strength characteristics could be further improved in addition to the thermal fatigue characteristics.
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