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DUAL PRINTED CIRCUIT BOARD ASSEMBLY, PRINTED CIRCUIT BOARD AND MODULAR PRINTED CIRCUIT BOARD

机译:双印制电路板组件,印制电路板和模块化印制电路板

摘要

A dual printed circuit board assembly, a printed circuit board, and a modular printed circuit board are provided. The printed circuit board includes a plurality of first connection points. The modular printed circuit board includes a plurality of second connection points. The modular printed circuit board is adapted to be mounted on the printed circuit board and includes a sensing unit, a first detecting unit, and a first notifying unit. The sensing unit outputs a detecting voltage according to a contact state between the first connection points and the second connection points. The first detecting unit determines whether the first connection points are respectively connected to the corresponding second connection points according to the detecting voltage. When one of the first connection points is not connected to the corresponding one of the second connection points, the first detecting unit controls the first notifying unit to issue a notification.
机译:提供了双印刷电路板组件,印刷电路板和模块化印刷电路板。印刷电路板包括多个第一连接点。模块化印刷电路板包括多个第二连接点。模块化印刷电路板适于安装在印刷电路板上,并且包括感测单元,第一检测单元和第一通知单元。感测单元根据第一连接点和第二连接点之间的接触状态输出检测电压。第一检测单元根据检测电压确定第一连接点是否分别与对应的第二连接点连接。当第一连接点中的一个未连接到对应的第二连接点中时,第一检测单元控制第一通知单元发出通知。

著录项

  • 公开/公告号US2017245366A1

    专利类型

  • 公开/公告日2017-08-24

    原文格式PDF

  • 申请/专利权人 WISTRON NEWEB CORP.;

    申请/专利号US201615222969

  • 申请日2016-07-29

  • 分类号H05K1/14;H05K1/11;G01R31/28;H05K1/02;

  • 国家 US

  • 入库时间 2022-08-21 13:50:00

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