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Integrated circuit packaging system with routable trace and method of manufacture thereof
Integrated circuit packaging system with routable trace and method of manufacture thereof
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机译:具有可路由迹线的集成电路封装系统及其制造方法
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摘要
A method of manufacture of an integrated circuit packaging system includes: providing routable traces including a first routable trace with a top plate and a second routable trace; mounting an integrated circuit partially over a second routable trace; forming an encapsulation over and around the first routable trace and the integrated circuit; forming a hole through the encapsulation to the top plate; and forming a protective coat directly on the encapsulation with the first routable trace between and in contact with the protective coat and the encapsulation.
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