Method for attaching electronic in in-depth coverage in the manufacture of electronic device and electronic device for fabricating

摘要

Method for attaching electronic in in-depth coverage in the manufacture of electronic device and a method for manufacturing electronic device to join a set of electronic to a cover sheet of the fund in the manufacture of an electronic device is presented.According to the method, the electronic assembly is fixed to the cover of the bottom using an adhesive cured by ultraviolet ("UV") modified.