REINFORCED WAFER LEVEL PACKAGE COMPRISING A CORE LAYER FOR REDUCING STRESS IN A SOLDER JOINT AND IMPROVING SOLDER JOINT RELIABILITY

摘要

Some features pertain to a package (200) that includes a redistribution portion (204) a first die (202) coupled to the redistribution portion a core layer (206) coupled to the redistribution portion and an encapsulation layer (208) encapsulating the first die and the core layer. The redistribution portion includes a first dielectric layer (240). The core layer has a higher Young s Modulus than the encapsulation layer. In some implementations the core layer includes a glass fiber (e.g. core layer is a glass reinforced dielectric layer). In some implementations the core layer has a Young s Modulus of about at least 15 gigapascals (Gpa). In some implementations the first die includes a front side and a back side where the front side of the first die is coupled to the redistribution portion. In some implementations the first dielectric layer is a photo imageable dielectric (PID) layer.