PCB PCB Printed Circuit BoardPCB method for fabricating the PCB and method for fabricating semiconductor package using the PCB

摘要

The technical concept of the present invention is to provide a printed circuit board (PCB) which has a structure of minimizing damage to a semiconductor package in a follow-up process by blocking an inflow of a foreign material in a molding process, a manufacturing method thereof, and a semiconductor package manufacturing method using the same. The PCB comprises: a substrate body which includes an active area on which semiconductor units are mounted in a two-dimensional array, and a dummy area which is an outer part of the active area, and has a rectangular structure in a long shape in a first direction; and a barrier formed along the first direction in a gate dummy area, of the dummy area, adjacent to a gate into which a molding resin is injected during the molding process.