JOINED BODY MANUFACTURING METHOD MULTILAYER JOINED BODY MANUFACTURING METHOD POWER-MODULE SUBSTRATE MANUFACTURING METHOD HEAT SINK EQUIPPED POWER-MODULE SUBSTRATE MANUFACTURING METHOD AND LAMINATED BODY MANUFACTURING DEVICE

摘要

Disclosed is a method for manufacturing a bonded body which can prevent displacement of bonding surfaces between the metal plates and the metal plate and the ceramic span when bonded to each other, thereby efficiently manufacturing these bonded bodies. A method of manufacturing a substrate for a power module is provided. The present invention provides a method of manufacturing a ceramic substrate (first member) 30, a ceramics substrate (second member) 20, a ceramic substrate (second member) The copper circuit board 30 and the ceramics substrate 20 are laminated and aligned with each other via the insulating substrate 40 and the tongue 40 is cooled to cool the laminated copper circuit board 30 and the ceramic substrate 20 And a bonding step of bonding the copper circuit board 30 and the ceramics substrate 20 by pressing the laminate 80 in the laminating direction to form a bonded body.