To prevent contact between the substrate and the substrate support or the substrate even if the substrate is warped (deformed). In the present invention, the substrate support 39 is moved from a position different from the positions A and C and the bent-down positions B and D which are partially bent along the outer peripheral edge of the substrate 8 toward the central portion of the substrate 8, . The present invention can be applied to a substrate sorting method (substrate sorting apparatus) for aligning one or more substrates 8 or a substrate receiving method (substrate receiving apparatus) for receiving the substrate 8 with the substrate support 39, (Substrate liquid processing apparatus) for collectively processing a plurality of substrates 8, and a substrate processing system 1 having these substrate aligning apparatuses, substrate receiving apparatuses, and substrate liquid processing apparatuses .
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