CORELESS BUILDUP SUPPORT SUBSTRATE AND PRINTED WIRING BOARD MANUFACTURED USING SAID CORELESS BUILDUP SUPPORT SUBSTRATE

摘要

And a method for manufacturing a printed wiring board comprising a microcircuit having a wiring width of 30 mu m or less with high dimensional accuracy and linearity as a buried circuit. To achieve this object, there is provided a coreless build-up supporting substrate for use in the production of a printed wiring board, which comprises a layer structure of an ultra-thin copper thin layer / release layer / carrier, And an insulating layer constituting material for constituting a support substrate laminated on the surface of the carrier of the extremely thin copper foil with the carrier, wherein the outer surface of the extremely thin copper foil with the carrier is 0.2 占 퐉? Wmax? 1.3 占 퐉, and 0.08 占 퐉? Ia? 0.43 占 퐉. Then, a printed wiring board is manufactured using the support substrate.