A method of soldering a first soldering partner to a second soldering partner using spacers

摘要

The invention relates to a method for soldering a first soldering partner (2) onto a mounting surface (3t) of a second soldering partner (3). The first soldering partner (2) has an upper side (2t) and an underside (2b) opposite the upper side (2t). In the method, a solder (5) between the mounting surface (3t) and the bottom (2b) is arranged and melted, that at a first time, the first solder partner (2) at a first location (S1) of the bottom (2b) a spacer (41) rests, the first solder partner (2) at a second location (S2) of the bottom (2b) against a spacer (42); and a third position (S3) of the lower surface (2b) of the first soldering partner (2) has a first distance (d1) from the mounting surface (3t). From a second point in time following the first point in time, the first soldering partner (2) and the second soldering partner (3) are pressed against one another such that the third point (S3) of the underside (2b) of the first soldering partner (2) projects from the mounting surface (3t) second distance (d2) which is smaller than the first distance (d1). During the pressing together, the solder is cooled below its solidus temperature to form a solid bonding layer extending continuously from the mounting surface (3t) to the bottom surface (2b) of the first soldering partner (2).