Pb-FREE SOLDER ALLOY, MANUFACTURING METHOD OF Pb-FREE SOLDER ALLOY, AND EVALUATION METHOD OF Pb-FREE SOLDER ALLOY

摘要

PROBLEM TO BE SOLVED: To provide a Pb-free solder alloy for high-temperature use, capable of suppressing generation of joint failure, and having joint reliability even under a high-temperature environment of 250°C.;SOLUTION: There is provided a Pb-free solder alloy mainly composed of Zn, and having a melting point of 300°C or higher and 450°C or lower. Concerning the Pb-free solder alloy, in the surface of the Pb-free solder alloy, a gloss value is 1,200 or higher, and L^* measured by a SCE method is 10.0 or more and 50.0 or less, a^* is -3.0 or more and -1.0 or less, and b^* is -9.0 or more and -4.0 or less.;SELECTED DRAWING: None;COPYRIGHT: (C)2018,JPO&INPIT