THICK FILM CONDUCTIVE PASTE AND MANUFACTURING METHOD OF CERAMIC MULTILAYER LAMINATE ELECTRONIC COMPONENT

摘要

PROBLEM TO BE SOLVED: To provide a thick film conductive paste capable of reducing shrinkage rate of a conductor formed by the thick film conductive paste before and after sintering so that thinning and fining each material are proceeded by proceeding downsizing of electronic components, not only sintering temperature can be controlled, but also cracks due to difference of shrinkage behavior by sintering of a green sheet and shrinkage behavior of a conductive pattern can be prevented, and capable of reducing specific electric resistance.;SOLUTION: There is provided a thick film conductive paste containing a metallic powder and an organic vehicle containing a binder resin and an organic solvent, the metallic powder has percentage content of 90 mass% to 97 mass% based on mass of the thick film conductive paste, and the metallic powder contains flake shaped metallic powder with a flake shape and D50 by volume based on particle size distribution obtained by measurement by a laser diffraction scattering type particle size distribution measurement method of 4.0 μm to 10 μm.;SELECTED DRAWING: None;COPYRIGHT: (C)2018,JPO&INPIT