Polymer composite thermal interface material with high thermal conductivity

摘要

The present invention relates generally to thermally conductive adhesives for thermal interfaces in electronic packaging, and more particularly, to a polymer-based composite thermal interface material (“TIM”) with an inter-penetrating network (IPN) polymer matrix consisting of polyurethane and an epoxy that is fully crosslinked. The IPN polymer matrix is designed to improve overall thermal conductivity by the altering the dispersion/distribution of thermally conductive fillers, the filler/polymer interfaces, and/or phonon scattering behaviors in the composite.