首页> 外国专利> ELECTROPLATING SOLUTION ANALYZER AND ELECTROPLATING SOLUTION ANALYSIS METHOD

ELECTROPLATING SOLUTION ANALYZER AND ELECTROPLATING SOLUTION ANALYSIS METHOD

机译:电镀溶液分析仪和电镀溶液分析方法

摘要

An electroplating solution analyzer includes an analysis container for housing an electroplating solution containing additives including an accelerator and a suppressor, a working electrode that is immersed in the electroplating solution housed in the analysis container to exchange electrons therewith, a reference electrode immersed in the electroplating solution and serves as a reference for determining a potential of the working electrode, a counter electrode immersed in the electroplating solution, a rotation drive unit for rotating the working electrode at a constant speed, a current-generating unit for supplying a current with a constant current density between the working electrode and the counter electrode, a potential measuring unit for measuring a potential between the working electrode and the reference electrode, and an analyzing unit for determining a condition of the electroplating solution in one or more measurement sections at an elapsed time after the current starts to be supplied.
机译:电镀溶液分析仪包括:分析容器,用于容纳包含添加剂的电镀溶液,所述添加剂包括促进剂和抑制剂;工作电极,其浸入容纳在分析容器中的电镀溶液中以与之交换电子;参比电极,其浸入电镀溶液中并且用作确定工作电极的电位的参考,浸入电镀液中的对电极,用于使工作电极以恒定速度旋转的旋转驱动单元,用于以恒定电流提供电流的电流生成单元在工作电极和对电极之间的密度,用于测量工作电极与参考电极之间的电势的电势测量单元,以及用于确定一个或多个测量区域中经过一段时间后的电镀液状态的分析单元当前开始被提供。

著录项

  • 公开/公告号US2018106757A1

    专利类型

  • 公开/公告日2018-04-19

    原文格式PDF

  • 申请/专利权人 TOPPAN PRINTING CO. LTD.;

    申请/专利号US201715843579

  • 发明设计人 MASAHIRO KOSUGI;TOSHIKAZU OKUBO;

    申请日2017-12-15

  • 分类号G01N27/42;G01N27/28;

  • 国家 US

  • 入库时间 2022-08-21 13:05:07

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