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BONDING MATERIAL, BONDED BODY OBTAINED BY THE SAME, AND MANUFACTURING METHOD OF BONDED BODY
BONDING MATERIAL, BONDED BODY OBTAINED BY THE SAME, AND MANUFACTURING METHOD OF BONDED BODY
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机译:粘接材料,同样获得的粘接体以及粘接体的制造方法
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摘要
A bonding material includes at least 0.1 wt % to at most 5 wt % of at least one element which may form a compound along with tin and carbon, and Sn as the main component of a remainder.
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