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OPTICAL MODULE INCLUDING SILICON PHOTONICS CHIP AND COUPLER CHIP

机译:包含硅光子芯片和耦合器芯片的光学模块

摘要

An optical module includes a waveguide interconnect that transports light signals; a Silicon Photonics chip that modulates the light signals, detects the light signals, or both modulates and detects the light signals; a coupler chip attached to the Silicon Photonics chip and the waveguide interconnect so that the light signals are transported along a light path between the Silicon Photonics chip and the waveguide interconnect; and one of the Silicon Photonics chip and the coupler chip includes first, second, and third alignment protrusions. The other of the coupler chip and the Silicon Photonics chip includes a point contact, a linear contact, and a planar contact. The point contact provides no movement for the first alignment protrusion. The linear contact provides linear movement for the second alignment protrusion. The planar contact provides planar movement for the third alignment protrusion.
机译:光学模块包括传输光信号的波导互连件;和调制光信号,检测光信号或同时调制和检测光信号的Silicon Photonics芯片;连接到硅光子芯片和波导互连的耦合器芯片,使得光信号沿着硅光子芯片和波导互连之间的光路传输;硅光子芯片和耦合器芯片中的一个包括第一,第二和第三对准突起。耦合器芯片和Silicon Photonics芯片中的另一个包括点接触,线性接触和平面接触。点接触不为第一对准突起提供运动。线性接触为第二对准突起提供线性运动。平面接触为第三对准突起提供平面运动。

著录项

  • 公开/公告号US2018306991A1

    专利类型

  • 公开/公告日2018-10-25

    原文格式PDF

  • 申请/专利权人 SAMTEC INC.;

    申请/专利号US201816016979

  • 申请日2018-06-25

  • 分类号G02B6/42;G02B6/293;G02B6/138;G02B6/12;G02B6/36;G02B6/122;G02B6/124;

  • 国家 US

  • 入库时间 2022-08-21 13:00:04

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