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Temperature drift compensation of MEMS resonators

机译:MEMS谐振器的温度漂移补偿

摘要

A resonator device comprising a piezoelectric material and at least one electrode, the device also provided with a material with a positive coefficient of stiffness, wherein the material is disposed in the device as an electrode or as a separate layer adjacent the piezoelectric material formed as one or more layers in the device. The material that performs the temperature compensating function is selected from the group consisting of ferromagnetic metal alloys, shape-memory metal alloys, and polymers, wherein the selected material has a temperature coefficient that varies with the relative amounts of the individual constituents of the compositions and wherein the composition is selected to provide the material with the positive coefficient of stiffness.
机译:一种包括压电材料和至少一个电极的谐振器装置,该装置还提供具有正刚度系数的材料,其中该材料作为电极或作为与形成为一个的压电材料相邻的单独层设置在装置中或设备中的更多层。执行温度补偿功能的材料选自铁磁金属合金,形状记忆金属合金和聚合物,其中所选材料的温度系数随组合物中各个成分的相对含量而变化,并且其中选择该组合物以提供具有正刚度系数的材料。

著录项

  • 公开/公告号US9837975B2

    专利类型

  • 公开/公告日2017-12-05

    原文格式PDF

  • 申请/专利权人 CYMATICS LABORATORIES CORP.;

    申请/专利号US201414230584

  • 发明设计人 DAVID FRANCOIS GUILLOU;RAJARISHI SINHA;

    申请日2014-03-31

  • 分类号H03H9/02;H03H3/04;H03H9/13;H03H9/17;

  • 国家 US

  • 入库时间 2022-08-21 12:54:18

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