首页> 外国专利> EVALUATION METHOD FOR OXIDE SEMICONDUCTOR THIN FILM, QUALITY CONTROL METHOD FOR OXIDE SEMICONDUCTOR THIN FILM, AND EVALUATION ELEMENT AND EVALUATION DEVICE USED IN SAID EVALUATION METHOD

EVALUATION METHOD FOR OXIDE SEMICONDUCTOR THIN FILM, QUALITY CONTROL METHOD FOR OXIDE SEMICONDUCTOR THIN FILM, AND EVALUATION ELEMENT AND EVALUATION DEVICE USED IN SAID EVALUATION METHOD

机译:氧化物半导体薄膜的评估方法,氧化物半导体薄膜的质量控制方法以及在所述评估方法中使用的评估要素和评估装置

摘要

Provided are: a method for measuring and evaluating (predicting or estimating) stress stability of an oxide semiconductor thin film in a contactless manner; and a quality control method for an oxide semiconductor. This evaluation method comprises a first step and a second step. The first step includes: subjecting an oxide semiconductor thin film to irradiation with both excitation light and microwave radiation; stopping the irradiation with the excitation light after the maximum intensity of reflected wave of the microwave radiation, which varies with the irradiation of the excitation light, from the thin film has been observed; and thereafter measuring a variation in the reflectance with which the microwave radiation is reflected by the thin film. The second step includes: calculating, from the variation in the reflectance, a parameter that corresponds to slow attenuation observed about 1 µs after the stopping; and thus evaluating the stress stability of the oxide semiconductor.
机译:提供:一种以非接触方式测量和评估(预测或估计)氧化物半导体薄膜的应力稳定性的方法;以及氧化物半导体的质量控制方法。该评估方法包括第一步和第二步。第一步包括:用激发光和微波辐射对氧化物半导体薄膜进行辐照;在从薄膜观察到微波辐射的反射波的最大强度(随激发光的照射而变化)之后,停止激发光的照射;然后,测量由薄膜反射微波辐射的反射率的变化。第二步骤包括:根据反射率的变化,计算与停止后约1 µs观察到的缓慢衰减相对应的参数;从而评估氧化物半导体的应力稳定性。

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