METHOD FOR MANUFACTURING INTEGRATED CIRCUIT DEVICES, OPTICAL DEVICES, MICROMACHINES AND MECHANICAL PRECISION DEVICES HAVING PATTERNED MATERIAL LAYERS WITH LINE-SPACE DIMENSIONS OF 50 NM AND LESS

摘要

METHOD FOR MANUFACTURING INTEGRATED CIRCUIT DEVICES, OPTICAL DEVICES, MICROMACHINES AND MECHANICAL PRECISION DEVICES, THE SAID METHOD COMPRISING THE STEPS OF (1) PROVIDING A SUBSTRATE HAVING PATTERNED MATERIAL LAYERS HAVING LINE-SPACE DIMENSIONS OF 50 NM AND LESS AND ASPECT RATIOS OF 2; (2) PROVIDING THE SURFACE OF THE PATTERNED MATERIAL LAYERS WITH A POSITIVE OR A NEGATIVE ELECTRICAL CHARGE BY CONTACTING THE SUBSTRATE AT LEAST ONCE WITH AN AQUEOUS, FLUORINE-FREE SOLUTION S CONTAINING AT LEAST ONE FLUORINE-FREE CATIONIC SURFACTANT A HAVING AT LEAST ONE CATIONIC OR POTENTIALLY CATIONIC GROUP, AT LEAST ONE FLUORINE-FREE ANIONIC SURFACTANT A HAVING AT LEAST ONE ANIONIC OR POTENTIALLY ANIONIC GROUP, OR AT LEAST ONE FLUORINE-FREE AMPHOTERIC SURFACTANT A; AND (3) REMOVING THE AQUEOUS, FLUORINE-FREE SOLUTION S FROM THE CONTACT WITH THE SUBSTRATE. (FIG.1)