USE OF HYDROPHOBIC EPOXIDE RESIN SYSTEM FOR ENCAPSULATION OF A INSTRUMENT TRANSFORMER

摘要

The present invention relates to a composition comprising (a) a cycloaliphatic epoxy resin, (b) a polyoxyalkylene diglycidyl ether, (c) an OH-terminated polysiloxane, (d) a cyclic polysiloxane, and (e) A curable composition for padding-pre-encapsulation of an instrumental transformer comprising an activator, (h) a curing agent selected from a filler, (g) anhydride, and (h) a curing accelerator selected from an accelerator for anhydride curing of an epoxy resin. / RTI