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DEVICE FOR APPLICATION OF GALVANIC COATING FROM COPPER-NICKEL ALLOY

机译:铜镍合金电镀层的应用装置

摘要

FIELD: metallurgy.;SUBSTANCE: invention relates to the field of electroplating and can be used for plating from copper-nickel alloy. Proposed device comprises a cathode chamber which contains a part, anodic chamber, anode located in the anode chamber, electrically conductive diaphragm separating the cathode chamber and the anode chamber from each other, reservoir controlling the redox potential of the cathode chamber for regulating the oxidation-reduction potential of the electrolyte in the cathode chamber, reservoir controlling the oxidation-reduction potential of the anode chamber for regulating the oxidation-reduction potential of the electrolyte in the anode chamber, as well as power supply unit that provides the flow of electrical current between the part and the anode.;EFFECT: technical result: increasing the stability of the formation of a galvanic coating from copper-nickel alloy with a uniform composition and an increase in the period of use of the electrolyte.;7 cl, 6 tbl, 4 ex, 2 dwg
机译:技术领域本发明涉及电镀领域,可用于铜镍合金的电镀。所提出的装置包括:阴极室,该阳极室包含一部分,阳极室,位于阳极室中的阳极,将阴极室和阳极室彼此分隔开的导电隔膜,用于控制阴极室氧化还原电势以调节氧化的储存器,阴极室中电解质的还原电势,控制阳极室中氧化还原电势以调节阳极室中电解质氧化还原电势的储存器,以及在两室之间提供电流流动的电源单元效果:技术成果:提高了成分均匀的铜-镍合金电镀层形成的稳定性,并延长了电解液的使用时间。; 7 cl,6 tbl, 4 ex,2 dwg

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