Thermosetting silicone resin composition for primary sealing of photo coupler, photo coupler sealed with the composition, and optical semiconductor device having the photo coupler

摘要

PROBLEM TO BE SOLVED: To provide: a thermosetting silicone resin composition for photocoupler primary seal, which is superior in heat resistance and curability, and which is subjected to no coloration and small in transmittance change in molding as well as after curing; a photocoupler sealed by the composition; and an optical semiconductor device having the photocoupler.SOLUTION: A thermosetting silicone resin composition for photocoupler primary seal comprises (A) a condensation reaction type resin-like organopolysiloxane which is solid at 25°C: 70-95 pts.mass, (B) an organopolysiloxane having a straight-chain diorganopolysiloxane residue, and having, in 1 molecule, at least one cyclohexyl group or phenyl group: 5-30 pts.mass (on the supposition that the total of the components (A) and (B) is 100 pts.mass), (C) an inorganic filler: 300-900 pts.mass, (D) an organic metal-based condensation catalyst: 0.01-10 pts.mass, (E) an ion-trap agent with zirconium supported thereon: 2-30 pts.mass, and (F) a mold-release agent: 0.5-10 pts.mass.SELECTED DRAWING: None