首页> 外国专利> PLATING IMPROVER, MOLDED BODY FOR PLATING, PLATING MOLDED BODY, AND PLATING METHOD

PLATING IMPROVER, MOLDED BODY FOR PLATING, PLATING MOLDED BODY, AND PLATING METHOD

机译:铺装模具,用于铺装的模具,铺装模具和铺装方法

摘要

To provide a plating improver which is blended in a molding material forming a resin molded body for plating together with a thermoplastic resin, and provides a molded body for plating that is excellent in impact resistance and can efficiently form a metal film or an alloy film thereon by plating, a molded body for plating, and the like.SOLUTION: A plating improver contains heterogenous phase polymer particles having a coefficient of variation of a particle diameter of 40-90%, where a content ratio of the polymer particles having a particle diameter of 0.05 μm or more is 80 vol.% or more based on the whole heterogenous phase polymer particles, and a content ratio of the polymer particles having a particle diameter of 0.05 μm or more and less than 0.15 μm is 10-60 vol.% based on the whole heterogenous phase polymer particles.SELECTED DRAWING: None
机译:本发明提供一种镀敷改良剂,其与热塑性树脂一起混入形成用于镀敷的树脂成型体的成型材料中,并提供耐冲击性优异且可在其上高效地形成金属膜或合金膜的镀敷成型体。解决方案:镀覆改进剂包含具有40-90%的粒径变化系数的异相聚合物颗粒,其中具有粒径的聚合物颗粒的含量比相对于全部非均相聚合物颗粒,0.05μm以上的聚合物颗粒为80体积%以上,粒径为0.05μm以上且小于0.15μm的聚合物颗粒的含有比例为10〜60体积%。基于整个非均相聚合物颗粒。

著录项

相似文献

  • 专利
  • 外文文献
  • 中文文献
获取专利

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号