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ケースレスフィルムコンデンサおよびその製造方法

机译:无壳薄膜电容器及其制造方法

摘要

PROBLEM TO BE SOLVED: To provide a caseless film capacitor in which a void is prevented from being obvious and of which the appearance is made satisfactory, by excellently preventing the generation of the void which influences a humidity resistance performance, volumetric efficiency and production efficiency regarding the caseless film capacitor.;SOLUTION: A cavity 30 consists of a lower die nest 12 and an upper die nest 22. The upper die nest is a combination type of an annular peripheral wall part 23 which is opened in a vertical direction, and a top plate part 24 which is placed at an upper edge of the peripheral wall part. In a state where a film capacitor element 41 is accommodated in the cavity, a resin 50 is injected to fill the inside of the cavity while exhausting air by sucking a negative pressure in the cavity via a mating surface A between the peripheral wall part and the top plate part. As the upper die nest, an entire surface of a bottom face 24a of a front plate part opposite to the cavity is formed into a flat surface, and the flat bottom face 24a and an inner peripheral surface 23b of the peripheral wall part cross each other in a substantial corner orthogonal state.;SELECTED DRAWING: Figure 1;COPYRIGHT: (C)2019,JPO&INPIT
机译:解决的问题:提供一种无外壳的薄膜电容器,其中通过显着地防止影响耐湿性能,体积效率和生产效率的空隙的产生,防止了空隙的出现,并且其外观令人满意。解决方案:空腔30由下模座12和上模座22组成。上模座是在垂直方向上开口的环形周壁部23和环形模壁的组合形式。顶板部24位于周壁部的上缘。在将薄膜电容器元件41容纳在空腔中的状态下,通过经由周壁部与壳体之间的配合面A将空腔内的负压吸引来排出空气,同时注入树脂50以填充空腔内部。顶板部分。作为上模具巢,将与空腔相对的前板部的底面24a的整个表面形成为平坦面,该平坦的底面24a与周壁部的内周面23b相交。处于基本角正交状态。;选定的图纸:图1;版权:(C)2019,JPO&INPIT

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