首页>
外国专利>
Resin composition, carrier film with resin, carrier film with insulating resin, primer layer for plating process, manufacturing method of primer layer for plating process, carrier film with primer for plating process, wiring board, and wiring Manufacturing method of plate
Resin composition, carrier film with resin, carrier film with insulating resin, primer layer for plating process, manufacturing method of primer layer for plating process, carrier film with primer for plating process, wiring board, and wiring Manufacturing method of plate
PROBLEM TO BE SOLVED: To provide a resin composition which makes it possible to obtain a primer layer for plating process having excellent adhesive force to a conductor layer and showing excellent laser processability.SOLUTION: The present invention provides a resin composition comprising (A) polyfunctional epoxy resin, (B) active ester group-containing compound, and (C) inorganic filler with a specific surface of 20 m/g or more.SELECTED DRAWING: None
展开▼
机译：解决的问题：提供一种树脂组合物，该树脂组合物能够获得对导体层具有优异的粘合力并显示出优异的激光加工性的用于电镀工艺的底漆层。解决方案：本发明提供一种包含（A）多官能团的树脂组合物。环氧树脂，（B）含活性酯基的化合物和（C）比表面积为20 m / g或更高的无机填料。
展开▼
